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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/20 datashee t tsz22111 ? 14 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 www.rohm.com power management switch ics for pcs and digital consumer products 1ch small package high side switch ics for usb devices and memory cards bd2248g description bd2248g is low on-resistance n-channel mosfet high-side power switches, optimized for universal serial bus (usb) applications. bd2248g is equipped with the function of over-c urrent detection, thermal shutdown, under-voltage lockout and soft-start. features ? reverse current protection when power switch off ? output discharge function ? over-current detection ? thermal shutdown ? open-drain fault flag output ? under-voltage lockout ? soft-start circuit ? control input logic active-high ? esd protection applications usb hub in consumer appliances, car accessory, pc, pc peripheral equipment, and so forth key specifications ? input voltage range: 2.7v to 5.5v ? on resistance: (vin=5v) 110m ? (typ.) ? over current threshold: 0.2a min., 0.4a max. ? standby current: 0.01 a (typ.) ? operating temperature range: -40 to +85 package (typ.) (typ.) (max.) ssop5 2.90mm x 2.80mm x 1.25mm typical application circuit ssop5 figure 1. typical application circuit 10k ? ~ 100k ? c l c in vingnd en vou t / oc 5v (typ.) + - 3.3v downloaded from: http:///
2/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 block diagram pin configuration pin descriptions pin no. symbol i/o function 1 vin - switch input and the supply voltage for the ic. 2 gnd - ground. 3 en i enable input. high level input turns on the switch. 4 /oc o over-current noti fication terminal. low level output during over-curr ent or over-temperature condition. open-drain fault flag output. 5 vout o switch output. figure 2. block diagram figure 3. pin configuration (top view) vin gnd en 1 2 3 4 5 /oc vout downloaded from: http:///
3/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 absolute maximum ratings (ta=25 ) parameter symbol ratings unit vin supply voltage v in -0.3 to 6.0 v en input voltage v en -0.3 to 6.0 v /oc voltage v /oc -0.3 to 6.0 v /oc sink current i /oc 5 ma vout voltage v out -0.3 to 6.0 v storage temperature t stg -55 to 150 power dissipation pd 675 *1 mw *1 mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 5.4mw per 1 above 25 recommended operating ratings parameter symbol ratings unit min. typ. max. vin operating voltage v in 2.7 5.0 5.5 v operating temperature t opr -40 - 85 electrical characteristics (v in = 5v, ta= 25 , unless otherwise specified.) dc characteristics parameter symbol limits unit conditions min. typ. max. operating current i dd - 130 175 a v en = 5v, v out = open, v in = 5v - 90 120 v en = 3.3v, v out = open, v in = 3.3v standby current i stb - 0.01 5 a v en = 0v, v out = open, v in = 5v en input voltage v enh 2.0 - - v high input, v in = 3.3 to 5v v enl - - 0.8 v low input, v in = 5v - - 0.6 low input, v in = 3.3v en input leakage i en -1 0.01 1 a v en = 0v or 5v on-resistance r on - 110 155 m ? i out = 100ma, v in = 5v - 130 180 i out = 100ma, v in = 3.3v reverse leak current i rev - - 1 a v out = 5v, v in = 0v over-current threshold i th 200 300 400 ma v in = 5v 190 290 390 v in = 3.3v short circuit output current i sc 100 200 300 ma v out = 0v,rms, v in = 3.3 to 5v output discharge resistance r disc 30 60 120 ? i disc = 1ma, v in = 5v 50 100 200 i disc = 1ma, v in = 3.3v /oc output low voltage v /oc - - 0.4 v i /oc = 0.5ma, v in = 3.3 to 5v uvlo threshold v tuvh 2.1 2.3 2.5 v v in increasing v tuvl 2.0 2.2 2.4 v v in decreasing ac characteristics parameter symbol limits unit conditions min. typ. max. output rise time t on1 - 1 6 ms r l = 500 ? , v in = 3.3 to 5v output turn-on time t on2 - 1.5 10 ms r l = 500 ? , v in = 3.3 to 5v output fall time t off1 - 1 20 s r l = 500 ? , v in = 3.3 to 5v output turn-off time t off2 - 3 40 s r l = 500 ? , v in = 3.3 to 5v /oc delay time t /oc 10 15 20 ms v in = 5v 11 16 21 v in = 3.3v downloaded from: http:///
4/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 measurement circuit vin gnd en vout /oc v in v en a 1f vin gnd en vout /oc v in v en a 1f r l operating current en, input vo ltage, output rise/fall time vin gnd en vout /oc v in v en a 1f i out 10k ? vin gnd en vout /oc v in v en a 1f i oc on-resistance, over-current de tection /oc output low voltage figure 4. measurement circuit timing diagram figure 5. output rise/fall time t on1 t off1 90% 10% 10% t on2 t off2 50% 50% 90% v en v out downloaded from: http:///
5/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 typical performance curves 0 20 40 60 80 100 120 140 160 23456 supply voltage : v in [v] operating current : i dd [ a] ta=25c figure 6. operating current en enable 0 20 40 60 80 100 120 140 160 -50 0 50 100 ambient temperature : ta[ ] operating current : i dd [ a] v in =5.0v figure 7. operating current en enable 0.0 0.2 0.4 0.6 0.8 1.0 23456 supply voltage : v in [v] standby current : i stb [ a] ta=25c figure 8. standby current en disable 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] standby current : i stb [ a] vin=5.0v figure 9. standby current en disable downloaded from: http:///
6/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 typical performance curves - continued 0.0 0.5 1.0 1.5 2.0 23456 supply voltage : v in [v] enable input voltage : v en [v] ta=25c low to high high to lo w figure 10. en input voltage 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[ ] enable input voltage : v en [v] vin=5.0v low to high high to lo w figure 11. en input voltage 0 50 100 150 200 23456 su ppl y vol tage : v in [v] on resistance : r on [m ] ta=25c figure 12. on-resistance 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] on resistance : r on [m ] v in =5.0v figure 13. on-resistance downloaded from: http:///
7/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 typical performance curves - continued 0.0 0.1 0.2 0.3 0.4 0.5 0.6 -50 0 50 100 ambient temperature : ta[ ] overcurrent threshold : i th [a] v in =5.0v figure 15. over-current threshold 0 20 40 60 80 100 23456 su ppl y vol tage : v in [v] /oc output low voltage:v /oc [mv] ta=25c figure 16. /oc output low voltage 0 20 40 60 80 100 - 5 005 01 0 0 ambient temperature : ta[ ] /oc output low voltage:v /oc [mv] v in =5.0v figure 17. /oc output low voltage 0.0 0.1 0.2 0.3 0.4 0.5 0.6 23456 supply voltage : v in [v] overcurrent threshold : i th [a] ta=25c figure 14. over-current threshold downloaded from: http:///
8/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] rise time : t on1 [ms] vin=5.0v figure 21. output rise time 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature : ta[ ] uvlo threshold : v tuvh , v tuvl [v] vin=5.0v v tuvh v tuvl figure 18. uvlo threshold 0.0 0.2 0.4 0.6 0.8 1.0 - 5 005 01 0 0 ambient temperature : ta[ ] uvlo hysteresis voltage:v hsy [v] vin=5.0v figure 19. uvlo hysteresis voltage 0.0 1.0 2.0 3.0 4.0 5.0 23456 supply voltage : v in [v] rise time : t on1 [ms] ta=25c figure 20. output rise time downloaded from: http:///
9/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 23456 supply voltage : v in [v] turn on time : t on2 [ms] ta=25c figure 22. output turn-on time 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] turn on time : t on2 [ms] vin=5.0v figure 23. output turn-on time 0.0 1.0 2.0 3.0 4.0 5.0 23456 supply voltage : v in [v] fall time : t off1 [ s] ta=25c figure 24. output fall time 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] fall time : t off1 [ s] vin=5.0v figure 25. output fall time downloaded from: http:///
10/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 6.0 23456 supply voltage : v in [v] turn off time : t off2 [ s] ta=25c figure 26. output turn-off time 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 0 50 100 ambient temperature : ta[ ] turn off time : t off2 [ s] v in =5.0v figure 27. output turn-off time 10 12 14 16 18 20 23456 supply voltage : v in [v] /oc ddlay time : t /oc [ms] ta=25c figure 28. /oc delay time 10 12 14 16 18 20 -50 0 50 100 ambient temperature : ta[ ] /oc ddlay time : t /oc [ms] v in =5.0v figure 29. /oc delay time downloaded from: http:///
11/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 typical performance curves - continued 0 50 100 150 200 23456 supply voltage : vin[v] disc on resistance : r disc [ ] ta=25c figure 30. discharge on resistance 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] disc on resistance : r disc [ ? ] v in =5.0v figure 31. discharge on resistance downloaded from: http:///
12/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 typical wave forms time (5ms/div.) figure 35. over-current response ramped load v/oc (5v/div.) vout (5v/div.) iout (0.2a/div.) v in =5v time (1ms/div.) figure 34. inrush current response (5v/div.) ven iout (0.1a/div.) c l =22uf c l =47uf c l =100uf v in =5v r l =50 v/oc (5v/div.) time (1ms/div.) figure 32. output rise characteristic ven (5v/div.) v/oc (5v/div.) vout (5v/div.) iout (0.1a/div.) v in =5v r l =50 time (1us/div.) figure 33. output fall characteristic ven (5v/div.) v in =5v r l =50 v/oc (5v/div.) vout (5v/div.) iout (0.1a/div.) downloaded from: http:///
13/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 v in =5v typical wave forms - continued time (5ms/div.) figure 39. uvlo response increasing vin vin (5v/div.) vout (5v/div.) iout (10ma/div.) r l =500 time (5ms/div.) figure 38. over-current response 1 load to enabled device v/oc (5v/div.) vout (5v/div.) iout (1a/div.) v in =5v time (5ms/div.) figure 36. over-current response enable to shortcircuit ven (5v/div.) v/oc (5v/div.) vout (5v/div.) v in =5v iout (0.2a/div.) time (500ms/div.) figure 37. over-current response enable to shortcircuit v in =5v ven (5v/div.) v/oc (5v/div.) vout (5v/div.) iout (0.2a/div.) downloaded from: http:///
14/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 typical wave forms - continued time (10ms/div.) figure 40. uvlo response decreasing vin vin (5v/div.) vout (5v/div.) iout (10ma/div.) r l =500 downloaded from: http:///
15/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 typical application circuit controller 10k ? ~ 100k ? c l c in vingnd en vou t / o c 5v (typ.) + - figure 41. typical application circuit application information when excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to ic, and may cause bad influences upon ic actions. in order to avoid this case, connect a bypath capacitor c in by vin terminal and gnd terminal of ic. 1 f or higher is recommended. in order to decrease voltage fluctuations of power source line to ic, connect a low esr capacitor in parallel with c in. 10 f to 100 f or higher is effective. pull up /oc output by resistance 10k ? to 100k ? . set up value, which satisfies the application as c l . this system connection diagram doesn?t guarantee operating as the application. when using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including static and transitional characteristics as well as dispersion of the ic. functional description 1. switch operation vin terminal and vout terminal are connected to the drain and the source of switch mosfet respectively. and the vin terminal is used also as power source input to internal control circuit. when the switch is turned on from en control input, vin terminal and vout terminal are connected by an 110m ? (typ.) switch. in on status, the switch is bidirectional. therefore, when the potential of vout terminal is higher than that of vin terminal, current flows from vout terminal to vin terminal. since a parasitic diode between the drain and the source of switch mosfet is canceled, in the off status, it is possible to prevent current from flowing reversely from vout to vin. 2. thermal shutdown circuit (tsd) if over-current would continue, the temperature of the ic wo uld increase drastically. if the junction temperature were beyond 135 (typ.) in the condition of over-current detection, thermal shutdown circuit operates and makes power switch turn off and outputs fault flag (/oc). then, when the junction temperature decreases lower than 115 (typ.), power switch is turned on and fault flag (/oc) is cancelled. unless the fact of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. the thermal shutdown circuit operates when the switch is on (en signal is active). 3. over-current detection (ocd) the over-current detection circuit limits current (i sc ) and outputs fault flag (/oc) when current flowing in each switch mosfet exceeds a specified value. there are three types of response against over-current. the over-current detection circuit works when the switch is on (en signal is active). 3-1. when the switch is turned on while the output is in shortcircuit status when the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon. downloaded from: http:///
16/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 3-2. when the output shortcircuits while the switch is on when the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over-current limit circuit reacts. when the current detecti on, limit circuit works, current limitation is carried out. 3-3. when the output current increases gradually when the output current increases gradually, current limitation does not work until the output current exceeds the over-current detection value. when it exceeds the detection value, current limitation is carried out. 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on until the vin exceeds 2.3v(typ.). if the vin drops below 2.2v(typ.) while the switch turns on, then uvlo shuts off the power switch. uvlo has hysteresis of a 100mv(typ). under-voltage lockout circuit works when the switch is on (en signal is active). 5. fault flag (/oc) output fault flag output is n-mos open drain output. at detection of over-current, thermal shutdown, low level is output. over-current detection has delay filter. this delay filter prev ents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. figure 42. over-current detection v en v out i out v /oc output shortcircuit thermal shutdown delay figure 43. over-current detection, thermal shutdown timing v out i out v /oc t /oc over current detection i sc over current load removed i th downloaded from: http:///
17/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 power dissipation (ssop5 package) figure 44. power dissipation curve (pd-ta curve) i/o equivalence circuit symbol pin no. equivalent circuit en 3 en vout 5 vout /oc 4 /oc * 70mm x 70mm x 1.6mm glass epoxy board 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 ambient temperature : ta [ ] power dissipation : pd [mw] 85 downloaded from: http:///
18/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteristics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can break down ics. take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. in this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly c heck to be sure the characteristics of the capacitor to b e used present no problem including the occurrence of capacity dropout at a lo w temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient . (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong electromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connected to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each process. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are inevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. (12) thermal shutdown circuit (tsd) when junction temperatures become detecte d temperatures or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit is aimed at isolating the lsi from thermal runaway as much as possible. do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taking into account the power dissipation (pd) in actual states of use. downloaded from: http:///
19/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 ordering information b d 2 2 4 8 g - t r part number package g: ssop5 packaging and forming specification tr: embossed tape and reel physical dimension tape and reel information marking diagram status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin (unit : mm) ssop5 2.9 0.2 0.13 4 + 6 4 1.6 2.8 0.2 1.1 0.05 0.05 0.05 + 0.2 0.1 + 0.05 0.03 0.42 + 0.05 0.04 0.95 5 4 12 3 1.25max. 0.2min. 0.1 s s part number marking ssop5(top view) lot number k 0 downloaded from: http:///
20/20 datasheet datasheet bd2248g ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0e3e0h300010-1-2 25.jul.2012 rev.001 revision history date revision changes 25.jul.2012 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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